Microstructure and properties of ultrasonic-assisted gallium-based alloys for room-temperature bonding of Cu/Cu

Room-temperature welding with gallium is regarded as a new strategy because of the low melting point and its affinity for forming intermetallic compounds other metals. Benefitting from liquid gallium-based solder an ultrasonic drive, establishment Cu/Cu diffusion-bond connections can be quickly completed. The underlying characteristics weld quality room-temperature bonding were preliminarily clarified perspectives process parameters composition. To further determine these characteristics, research directions including features product formed by ultrasonic-driven bonding, interface microstructure, element distribution shear strength joint then determined.